Two-Component Epoxy Sealant GW6113A/B

Two-Component Epoxy Sealant GW6113A/B – Solvent-Free Potting Compound for High-Performance Applications

Product Overview
GW6113A/B is a two-component, solvent‑free epoxy potting and sealing compound designed for demanding applications in the automotive industry, automotive electronics, power tools, reactors, and high‑thermal‑conductivity instruments. It cures at room temperature, providing a reliable encapsulation that meets product protection requirements while delivering excellent adhesion and thermal stability.

Key Features

• High thermal conductivity – efficiently dissipates heat from sensitive components, ensuring reliable operation.

• Outstanding adhesion – bonds well to various substrates (metals, ceramics, plastics, glass), preventing delamination.

• Excellent thermal stability – can be used continuously at temperatures ranging from 150°C to 180°C, with good resistance to thermal cycling.

• Low coefficient of thermal expansion (CTE) – minimizes stress on components during temperature changes, reducing the risk of cracking.

• Superior electrical insulation – maintains high dielectric strength and stability, protecting against short circuits and electrical failure.

• Very low water absorption – provides excellent water resistance and moisture barrier, enhancing long‑term reliability in humid environments.

• Crack resistance – formulated to withstand mechanical and thermal shock without fracturing.

Applications

• Automotive electronics – sensors, control units, ignition modules.

• Power tools – potting of motor windings, electronic controllers.

• High‑power devices – transformers, reactors, power supplies.

• Industrial instruments – requiring thermal management and protection from harsh environments.

• General electronic encapsulation where high thermal conductivity and reliability are needed.

Curing Conditions

• Cures at room temperature (typically 24 hours at 25°C).

• Heat can be applied to accelerate curing if needed, but room‑temperature curing is standard and convenient.

Processing
The two components (A and B) should be mixed thoroughly in the recommended ratio (typically supplied as a kit). After mixing, the material has a pot life that depends on temperature; lower temperatures extend working time. Apply to the components and allow to cure under ambient or heated conditions.

Handling and Storage

• Store both components in a cool, dry place, away from direct sunlight and heat sources.

• Keep containers tightly sealed to prevent contamination and moisture ingress.

• Shelf life: typically 12 months under recommended storage conditions.

• Use appropriate personal protective equipment (gloves, safety goggles) when handling uncured material.

Packaging
Available in various kit sizes (e.g., 100 g, 500 g, 1 kg, 5 kg) and custom packaging upon request.

Quality Assurance
Each batch is tested for viscosity, thermal conductivity, adhesion strength, dielectric properties, and curing behavior to ensure consistent performance.