Acid Mist Suppressant W-100 for Copper Electroplating

Acid Mist Suppressant W-100 – Fluorinated Surfactant for Copper Electroplating

Product Overview
W-100 is a specialized acid mist suppressant designed for use in electrolytic copper deposition processes. It is formulated from organic fluorinated surfactants and surface-active compounds, providing excellent mist suppression even in highly acidic environments. It significantly reduces acid mist generation from the electrolyte bath while maintaining low foam levels, ensuring a safer and cleaner working environment.

Technical Specifications

• Appearance: Amber liquid

• Composition: 45–55% chemical solids, 45–55% water

• Viscosity: ~100 cP

• Relative Density: ~1.2 g/cm³

• Flash Point: Non-flammable

• Solubility: Soluble in water, slightly acidic

• Environmental Profile: Non-toxic, biodegradable, environmentally friendly

• Performance: Maintains superior properties even in strong acid (inorganic salts) where conventional suppressants fail; does not form a foam layer on the electrolyte surface; does not interfere with metal deposition or product quality.

Key Benefits

• Excellent acid mist reduction – significantly lowers aerosol release from bursting oxygen bubbles.

• Low foam formation – avoids foam layer on bath surface, improving visibility and process control.

• Fluorinated surfactant technology – provides superior surface activity and stability in aggressive media.

• Non-flammable and biodegradable – safe for operators and the environment.

• No adverse effect on electroplating quality – maintains product integrity and coating properties.

Application Guidelines
W-100 is readily soluble in water and should be uniformly dispersed throughout the electrolyte. The typical dosage ranges from 10 to 30 ppm (active substance). After the initial concentration is established, weekly additions should be made based on the mist suppression effect. Recommended active concentration: 10–20 ppm. The concentration of W-100 in the electrolyte can be monitored by titration.

Applications

• Copper electroplating (electrolytic copper deposition) – reduces acid mist from oxygen bubble bursting.

• Suitable for other electrolytic processes where acid mist is a concern.

Handling and Disposal

• Wear appropriate protective clothing, gloves, and safety goggles when handling.

• In case of skin contact, wash thoroughly with water.

• Preferred disposal method: incineration at an industrial or commercial facility equipped for halogenated materials; combustion products contain hydrogen fluoride (HF). Ensure proper scrubbing of exhaust gases.

Storage

• Store in tightly sealed containers in a cool, dry, well-ventilated area, away from strong oxidizers and acids.

• Protect from freezing and direct sunlight.

Packaging
Available in 25 L, 200 L drums, and IBC containers. Custom packaging upon request.